Process
Wafer in
Module out
Mesh is developing new high volume optical manufacturing techniques
Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.
01
01/03
Pushing the Envelope in Photonics Packaging
Uniquely, AlphaC1’s optical engine is packaged entirely with flip chip die bonding, the same technology used to integrate chips in modern processors at high volume.
02
02/03
DESIGNED FOR HIGH VOLUME
Our focus on high volume extends from packaging through the entire production process. Each second of process accounted for and dialed in.
03
03/03
End to End Design
We own our designs end to end: design, simulate, build, test. We close the feedback loop between design and manufacturing, doing it all under the same roof.
